﻿@inproceedings{
dram:3d-thermal,
   Author = {Gerlach, David W. and Joshi, Yogendra K.},
   Title = {PARAMETRIC THERMAL MODELING OF 3D STACKED CHIP ELECTRONICS WITH INTERLEAVED SOLID HEAT SPREADERS},
   BookTitle = {Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems},
   Pages = {1208- 1212},
   Year = {2006} }



@article{
dram:intel,
   Author = {Iyer, J. and Hall, C. L. and Shi, J. and Huang, Y.},
   Title = {System memory power and thermal management in platforms built on Intel Centrino Duo mobile technology},
   Journal = {Intel Technology Journal},
   Volume = {10},
   Year = {2006} }



@inproceedings{
dram:isca06,
   Author = {Lin, Jiang and Zheng, Hongzhong and Zhu, Zhichun and David, Howard and Zhang, Zhao},
   Title = {Thermal modeling and management of DRAM memory systems},
   BookTitle = {International Symposium on Computer Architecture},
   Pages = {312 - 322 },
   Year = {2007} }



@misc{
dram:patent,
   Author = {Reed, David G. and Simeral, Brad W. and Surgutchik, Roman and Titus, Joshua},
   Title = {Method and system for memory temperature detection and thermal load management},
         Year = {2007} }



